Effects of film thickness on critical crack tip opening displacement in single-crystalline and polycrystalline submicron Cu films
Effects of film thickness on critical crack tip opening displacement in single-crystalline and polycrystalline submicron Cu films
复制标题
薄膜厚度对单晶和多晶亚微米铜薄膜临界裂纹尖端张开位移的影响
DOI：
10.1016/j.engfracmech.2016.03.031
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发表时间：
2016
影响因子：
5.4
通讯作者：
and Kohji MINOSHIMA
中科院分区：
文献类型：
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作者：
Hiroyuki HIRAKATA;Takuya YOSHIDA;Toshiyuki KONDO;and Kohji MINOSHIMA
We performedin-situfield emission scanning electron microscopy fracture toughness tests on single-crystalline and polycrystalline submicron-thick Cu films. In all specimens, the notch root became blunt, and a crack was initiated from the blunted notch root. The critical crack tip opening displacement (CTOD) for crack initiation,δi, was thickness dependent, whereδidecreased with a decrease in the thickness. The critical CTOD normalized by the thickness,δi/B, values of the films were similar (δi/B= 1.4–1.9), irrespective of the film thickness and microstructure. This suggested that the local fractures of the submicron Cu films were similar.
