DEVELOPMENT OF HEAT RESISTANT Pb-FREE JOINTS BY TLPS PROCESS OF Ag AND Sn-Bi-Ag ALLOY POWDERS
DEVELOPMENT OF HEAT RESISTANT Pb-FREE JOINTS BY TLPS PROCESS OF Ag AND Sn-Bi-Ag ALLOY POWDERS
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DOI：
10.2298/jmmb121123052o
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
I. Ohnuma;R. Kainuma;K. Ishida
中科院分区：
文献类型：
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作者：
I. Ohnuma;R. Kainuma;K. Ishida
TLPS（Transient Liquid Phase Sintering）工艺是利用低熔点的Sn-Bi基合金粉末与活性Ag粉反应制备耐热连接的一种备选方法。在高于Sn-Bi基合金的熔化温度的热处理期间，熔融的Sn-Bi与固体Ag颗粒快速反应，这导致形成耐热金属间化合物（IMC）。在本研究中，Sn-17 Bi-1Ag（at.%）研究了液相线温度为200°C的Ag粉末和纯Ag粉末。在差示扫描量热法（DSC）测量过程中，合金发生了放热反应和吸热反应，分别对应于Sn-Ag-3Sn-IMC相的形成和Sn-17 Bi-1Ag合金的熔化。在总体测量之后，所获得的反应物由Ag 3Sn-IMC相和富Bi相组成，这两者在高于250°C时开始熔化，具有少量的残留Sn-Bi共晶相。这些结果表明，TLPS工艺可以应用于无铅耐热键合。
TLPS (Transient Liquid Phase Sintering) process is a candidate method for heat-resistant bonding, which makes use of the reaction between low-melting temperature powder of Sn-Bi base alloys and reactive powder of Ag. During heat treatment above the melting temperature of a Sn-Bi base alloy, the molten Sn-Bi reacts rapidly with solid Ag particles, which results in the formation of a heat-resistant intermetallic compound (IMC). In this study, the TLPS properties between Sn-17Bi-1Ag (at.%) powder with a liquidus temperature of 200°C and pure Ag powder were investigated. During differential scanning calorimetry (DSC) measurement, an exothermic reaction and an endothermic reaction occurred, which correspond to the formation of the Ag 3 Sn-IMC phase and the melting of the Sn-17Bi-1Ag alloy, respectively. After the overall measurement, the obtained reactant consisted of the Ag 3 Sn-IMC and Bi-rich phases, both of which started melting above 250°C, with a small amount of the residual Sn-Bi eutectic phase. These results suggest that the TLPS process can be applied for Pb-free heat-resistant bonding.