Effect of atmospheric-pressure plasma jet on polycrystalline diamond micro-milling of silicon carbide
Effect of atmospheric-pressure plasma jet on polycrystalline diamond micro-milling of silicon carbide
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DOI：
10.1016/j.cirp.2015.04.097
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发表时间：
2015-01-01
影响因子：
4.1
通讯作者：
Yamazaki, Kazuo
中科院分区：
文献类型：
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作者：
Katahira, Kazutoshi;Ohmori, Hitoshi;Yamazaki, Kazuo
进行了一项研究，以调查在多晶金刚石 (PCD) 微端铣削过程中应用大气压等离子射流的效果。对铣削后使用和不使用等离子射流的 SIC 表面进行了比较。研究发现等离子射流可以形成平均粗糙度 (R-a) 为 0.73 nm 的高质量表面。所提出的等离子射流通过赋予刀具和工件表面亲水性以及去除加工过程中刀具边缘的表面污染物，在改善切屑形成过程方面非常有效。 (C) 2015 CIRP。
A study was performed to investigate the effects of the application of an atmospheric-pressure plasma jet during polycrystalline diamond (PCD) micro- end-milling. A comparison was made between SIC surfaces after milling, with and without the application of the plasma jet. The plasma jet was found to allow the formation of a high-quality surface with an average roughness (R-a) of 0.73 nm. The proposed plasma jet is highly effective in improving both the chip formation process, by imparting hydrophilicity to the tool and workpiece surfaces, and removing surface contamination at the tool edge during machining. (C) 2015 CIRP.