Demonstration of efficient relativistic electron acceleration by surface plasmonics with sequential target processing using high repetition lasers
Demonstration of efficient relativistic electron acceleration by surface plasmonics with sequential target processing using high repetition lasers
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DOI：
10.1103/physrevresearch.5.013062
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发表时间：
2023-01
影响因子：
4.2
通讯作者：
Y. Arikawa;A. Morace;Y. Abe;N. Iwata;Y. Sentoku;A. Yogo;K. Matsuo;M. Nakai;H. Nagatomo;K. Mima;H. Nishimura;S. Fujioka;R. Kodama;S. Inoue;M. Hashida;S. Sakabe;D. De Luis;G. Gatti;M. Huault;J. A. Pérez-Hernández;L. Roso;L. Volpe
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文献类型：
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作者：
Y. Arikawa;A. Morace;Y. Abe;N. Iwata;Y. Sentoku;A. Yogo;K. Matsuo;M. Nakai;H. Nagatomo;K. Mima;H. Nishimura;S. Fujioka;R. Kodama;S. Inoue;M. Hashida;S. Sakabe;D. De Luis;G. Gatti;M. Huault;J. A. Pérez-Hernández;L. Roso;L. Volpe
对于高重复频率超高强度激光系统，结构靶的自动对准是实现粒子加速和等离子体加热一致性的关键。在这项工作中，我们证明了有效的电子加速与两个连续的激光加工步骤，使用高重复率，30 fs的超高强度激光。第一个脉冲进行激光加工，并在平坦的不锈钢靶表面上创建一个陡峭的圆柱形凹坑。陨石坑是由受热表面的流体动力学膨胀和内部较深物质被非热相对论电子散射而形成的。弹坑形状得到很好的控制和再现，宽200 μm，深350 μm。第二个脉冲深入弹坑内部并与弹坑壁相互作用，通过表面等离子体有效地加速电子，而不需要重新对准目标。激光吸收效率从32.5%提高到97.5%。
For high repetition ultrahigh-intensity laser system, automatic alignment of structured target is key to achieving consistent particle acceleration and plasma heating. In this work, we demonstrate efficient electron acceleration with two sequential steps of laser processing using a high repetition rate, 30-fs ultrahigh-intensity laser. The first pulse does laser machining and creates a steep cylindrical crater on the surface of a flat stainless-steel target. The crater is formed by the hydrodynamic expansion of the heated surface and by spallation of the inner, deeper material by nonthermal relativistic electrons. The crater shape is well controlled and reproducible with 200 μm width and 350 μm depth. The second pulse irradiates deeply inside the crater and interacts with the crater wall, efficiently accelerating electrons via surface plasmonic, without need for target realignment. The laser absorption efficiency increases from 32.5 to 97.5% by the process.