Numerical simulation on a compact thermoelectric cooler for the optimized design
Numerical simulation on a compact thermoelectric cooler for the optimized design
复制标题
紧凑型热电冷却器优化设计的数值模拟
DOI：
10.1016/j.applthermaleng.2018.10.047
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发表时间：
2019-01-05
影响因子：
6.4
通讯作者：
Ming, Tingzhen
中科院分区：
文献类型：
--
作者：
Gong, Tingrui;Gao, Lei;Ming, Tingzhen
如今电子设备的功率密度不断增加，尺寸不断缩小，导致热量难以散发。由此产生的不均匀能量耗散和高局部热通量密度会产生导致热环境恶化的热点。热电冷却器（TEC）是一种很有前途的固态热泵，它利用珀耳帖效应来散热并消除电子设备的热点。在本文中，使用有限元方法对紧凑型 TEC 进行了三维数值模拟的优化设计，其中考虑了与温度相关的材料特性、汤姆逊效应和接触层电阻。优化包括输入电流、腿几何形状和接触层，通过这些优化，TEC 实现了最大的冷却性能和高运行可靠性。结果表明，模块内部输入电流产生的焦耳热对TEC性能和运行可靠性起着至关重要的作用。 TEC 中仍然存在由强温度梯度引起的可靠性问题。针对最佳性能和可靠性的要求，本研究提出了优化的TEC设计方法。
Nowadays electronic devices' increasing in power density and shrinking in size make it hard to remove the heat. The resulting uneven energy dissipation and high local heat flux density create hotspots that deteriorate the thermal environment. The thermoelectric cooler (TEC) is a promising solid-state heat pump that utilizes the Peltier effect to dissipate the heat and eliminate the hotspots of the electronic devices. In this article, three-dimensional numerical simulations have been performed for the optimization design of a compact TEC using finite element method, which take into account the temperature-dependent materials properties, Thomson effect, and the contact layer resistances. The optimization includes the input current, leg geometry, and contact layers, with which the TEC achieves the maximum cooling performance and high operation reliability. The results show that the Joule heat generated by the input current inside the module plays a crucial role in the TEC performance and the operation reliability. The strong temperature gradient-induced reliability issue still occurs in the TEC. With the requirements for optimal performance and reliability, the optimized TEC design approach is presented in this study.