Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder
Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder
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DOI：
10.1007/s10854-021-05954-y
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发表时间：
2021-04-27
影响因子：
2.8
通讯作者：
Liu, Wensheng
中科院分区：
文献类型：
--
作者：
Liu, Xiao;Wu, Siyuan;Liu, Wensheng
导电银浆作为电子产品中重要的互连材料，以其高导电性和柔性互连等优异性能，在芯片封装和印制电路板领域引起了广泛的研究兴趣。本文采用多种方法制备了银纳米颗粒、银球形颗粒和片状银粉末。选择不同比例的银制备微银浆料和微纳米（mn）银浆料（按银纳米颗粒：球形颗粒：片状银= 1：1：1制备）。与传统的高银含量的银浆料（含有80重量%的银）相比，本工作中的浆料仅含有66.67重量%的银。当球形颗粒与片状银粉的比例为1：1时，在空气中200 ℃固化45 min的微银浆的电阻率约为（3.31 ± 0.73）× 10（-5）Ω cm，银浆折叠10次后电阻略有上升。纳米银粒子的加入可以降低低温固化时的电阻率。锰银浆的耐折性与微银浆（球：片= 1：1）的耐折性相当。
As an important interconnection material in electronics, conductive silver paste has attracted much research interest in chip packaging and printed circuit board due to its predominant properties like high conductivity and flexible interconnection. In this paper, the silver nanoparticles, the silver sphere particles, and flake silver powders are fabricated by various methods. Different proportions of silver powder are selected to prepare micro-silver paste and micro-nano (mn) silver paste (fabricated by silver nanoparticles:sphere particles:flake silver powder = 1:1:1). Compared to traditional silver paste with high silver content (containing 80 wt% silver), paste in this work contains only 66.67 wt% silver. When the ratio of sphere particle to flake silver powder is 1:1, the electrical resistivity of micro-silver paste cured at 200 degrees C for 45 min in air is about (3.31 +/- 0.73) x 10(-5) omega cm, the resistance of silver paste rises a little bit after being folded by ten times. The addition of nano-silver particles can reduce the resistivity in lower temperature curing. The folding endurance of mn silver paste is comparable to that of micro-silver paste with sphere:flake = 1:1.