Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
Crack growth calculations in solder joints based on microstructural phenomena with X-FEM
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DOI：
10.1016/j.commatsci.2010.11.014
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发表时间：
2011
影响因子：
3.3
通讯作者：
A. Menk;S. Bordas
中科院分区：
文献类型：
--
作者：
A. Menk;S. Bordas
确定焊点在热机械载荷下的寿命对于保证电子器件的质量至关重要。疲劳过程在很大程度上取决于接头的微观结构。我们提出了一种新的方法来确定基于微观结构现象的关节的寿命。生成随机微观结构以捕获可能的微观结构的统计变化，并执行裂纹扩展计算。扩展的有限元方法被用来解决结构问题的数值，允许一个完整的自动化的过程。数值算例和实验数据进行了比较。
Determining the lifetime of solder joints subjected to thermomechanical loads is crucial to guarantee the quality of electronic devices. The fatigue process is heavily dependent on the microstructure of the joints. We present a new methodology to determine the lifetime of the joints based on microstructural phenomena. Random microstructures are generated to capture the statistical variety of possible microstructures and crack growth calculations are performed. The extended finite element method is used to solve the structural problem numerically which allows a complete automation of the process. Numerical examples are given and compared to experimental data.