Alternating ion plating—A method of high‐rate ion vapor deposition
Alternating ion plating—A method of high‐rate ion vapor deposition
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交替离子镀——一种高速离子气相沉积方法
DOI：
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发表时间：
1975
期刊：
影响因子：
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通讯作者：
K. Goedicke
中科院分区：
文献类型：
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作者：
S. Schiller;U. Heisig;K. Goedicke
在某些情况下，交替离子镀（AIP）会产生与传统离子镀（IP）相同的效果。如果蒸气和离子以在每个周期内相互适应的速率和作用时间交替作用于基底的每个点，则满足这些条件。基于涂层过程中的能量情况，结果表明，仅在有限范围内增加离子能量就可以增强凝聚物的能量活化。然而，正确选择电离布置可以改变离子与蒸气速率的比率，从而将能量激活改变几个数量级。给出了 AIP 的实验设置。在此基础上，对气相沉积法、压力镀法、交替离子镀法制备的镍膜的一些应用特性进行了研究；即光学反射率、对 H2S 蒸汽的耐腐蚀性以及根据 Hutschenreuter 孔隙率测试的保护作用。参考所检查的财产...
Under certain circumstances, alternating ion plating (AIP) results in the same effects as conventional ion plating (IP). These conditions are satisfied if vapor and ions alternately act on each point of the substrate at rates and action times that are mutually adapted within each period. Based on energy situations in the coating process, it is then shown that energetic activation of the condensate can be enhanced by an increase in ion energy only within a limited range. Proper selection of the ionization arrangement, however, allows alternation of the ratio of ion to vapor rates and thus to change energetic activation by some orders of magnitude. An experimental setup for AIP is given. After that, nickel films produced by vapor deposition, pressure plating, and alternating ion plating are investigated with respect to some applicative features; i.e., optical reflectivity, corrosion resistance to H2S vapor, and protective action as per the Hutschenreuter porosity test. With reference to the examined propert...