Thermally removable epoxy adhesives incorporating thermally reversible Diels-Alder adducts
Thermally removable epoxy adhesives incorporating thermally reversible Diels-Alder adducts
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DOI：
10.1080/00218460309540
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发表时间：
2003-06-01
影响因子：
2.2
通讯作者：
Aubert, JH
中科院分区：
文献类型：
--
作者：
Aubert, JH
热可逆胶粘剂是通过脂肪族二胺和含有两个Diels-Alder加合物的二氧基化合物的反应制备的。二环氧化合物是通过两个含环氧的呋喃和双马来酰亚胺之间的Diels-Alder反应形成的。胶粘剂的T-g为-40°c，剪切模量为约90°c。当温度超过90℃时，会发生反向Diels-Alder反应，导致模量的显著损失。模量的损失随温度的升高是可逆的。基于模量在高温下的损失，即，在模量较低的高温下，胶粘剂的键容易断裂，提出了一种热可逆胶粘剂。
Thermally reversible adhesives are prepared through the reaction of aliphatic diamines and a diepoxy compound containing two Diels-Alder adducts. The diepoxy compound is formed via the Diels-Alder reaction between two epoxy-containing furans and a bismaleimide. The adhesive displays a T-g of -40degreesC and a constant shear modulus up to approximately 90degreesC. At temperatures exceeding 90degreesC the retro Diels-Alder reaction occurs, which leads to a significant loss in modulus. The loss of modulus is reversible with temperature. A thermally reversible adhesive is proposed based upon the loss of modulus at an elevated temperature, i.e., adhesives bonds are easily broken at elevated temperature where the modulus is low.