Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices
Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices
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DOI：
10.1039/c4tc01820f
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发表时间：
2014-01-01
影响因子：
6.4
通讯作者：
Schubert, Ulrich S.
中科院分区：
文献类型：
--
作者：
Wuenscher, Sebastian;Abbel, Robert;Schubert, Ulrich S.
具有良好导电性的高分辨率结构是几乎所有电子设备的关键部件。通过在聚合物箔上印刷金属基导电油墨来生产这些代表了朝着工业规模制造塑料电子产品迈出的重要一步。为这些材料开发快速、高效和廉价的沉积后烧结技术是使这种方法在商业上可行的重要加工步骤。这篇综述讨论了导电的，含金属的油墨，可以通过喷墨印刷工艺处理的替代烧结方法的进展。每种烧结方法的机制，其与柔性电子领域常用材料的兼容性，其与高通量制造工艺的兼容性及其对柔性电子器件生产的适用性进行了研究。
Well-defined high resolution structures with excellent electrical conductivities are key components of almost every electronic device. Producing these by printing metal based conductive inks on polymer foils represents an important step forward towards the manufacturing of plastic electronic products on an industrial scale. The development of fast, efficient and inexpensive post-deposition sintering technologies for these materials is an important processing step to make this approach commercially viable. This review discusses the advances in alternative sintering approaches for conductive, metal containing inks, which can be processed by inkjet-printing processes. Each sintering approach is examined regarding its mechanism, its compatibility with commonly used materials in the field of flexible electronics, its compatibility with high-throughput manufacturing processes and its applicability to the production of flexible electronic devices.