Delamination Strength of the Soldered Joint in YBCO Coated Conductors and Its Enhancement
Delamination Strength of the Soldered Joint in YBCO Coated Conductors and Its Enhancement
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DOI：
10.1109/tasc.2015.2409197
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发表时间：
2015-03
影响因子：
1.8
通讯作者：
Wei Liu;Xingyi Zhang;Jùn Zhou;Youhe Zhou
中科院分区：
文献类型：
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作者：
Wei Liu;Xingyi Zhang;Jùn Zhou;Youhe Zhou
我们现在报告的分层性能的焊接搭接接头在YBa_2Cu_3O_（7-x）涂层导体（YBCO CC）没有删除的金属稳定剂。研究了77 K时搭接接头在横向拉伸下的脱层强度、电流和电阻行为。结果表明，在可见分层之前，电流没有下降（以原始YBCO CC样品临界电流Ic 0的95%为标准），而搭接接头的电阻没有明显变化。此外，搭接接头表现出显着的边缘效应的临界砧强度，这可以提高高达原来的CC样品通过添加焊料圆角在边缘的接头。此外，利用三维有限元分析软件ANSYS成功地模拟了文献报道的YBCO CC试样中YBCO层（包括缓冲层）和Hastelloy的分层，并解释了本文所报道的搭接接头分层强度的提高。
We now report the delamination properties of soldered lap joints in YBa2Cu3O7-x coated conductors (YBCO CCs) without removing the metallic stabilizer. The delamination strength, current, and resistance behaviors in the lap joints under transverse tension are investigated at 77 K. It is found that the current shows no degradation (95% of the critical current Ic0 in original YBCO CC sample as a criterion) before a visible delamination, whereas there is no remarkable change in resistance of the lap joints. Moreover, the lap joint shows significant edge effects on the critical anvil strength, which can be raised as high as the original CC samples by adding solder fillets at the edge of the joint. In addition, the delamination of the YBCO layer (including Buffer layer) and Hastelloy in YBCO CC samples presented in literature is successfully simulated by using a 3-D ANSYS, and the enhancement of delamination strength in the lap joint reported in this paper is also interpreted by the simulation.