Development of wire spraying for direct micro-patterning via an atmospheric-pressure UHF inductively coupled microplasma jet
Development of wire spraying for direct micro-patterning via an atmospheric-pressure UHF inductively coupled microplasma jet
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DOI：
10.1016/j.surfcoat.2005.01.113
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发表时间：
2006-04
影响因子：
5.4
通讯作者：
Y. Shimizu;T. Sasaki;A. C. Bose;K. Terashima;N. Koshizaki
中科院分区：
文献类型：
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作者：
Y. Shimizu;T. Sasaki;A. C. Bose;K. Terashima;N. Koshizaki
我们通过直径为20-50μm的大气压感应耦合微等离子体射流，开发了用于直接微图形制作的线喷涂。通过感应加热和微等离子体的热传导，在几十瓦的功率下，插入喷嘴的直径为50-100μm的金属丝被有效地熔化或蒸发，产生的雾化液滴随着等离子体-气体流动被喷射出来。大部分喷涂颗粒在加工过程中被氧化，并在聚合物基材上局部形成由金属氧化物颗粒组成的沉积物。由于等离子体尺寸小、能量供应少、热流密度低，这种喷涂方法非常适合于在低熔点的聚合物基片上沉积。此外，通过对衬底的线性平移，论证了微米级线条绘制的可行性。
We developed wire spraying for direct micro-patterning via an atmospheric-pressure inductively coupled microplasma (AP-ICMP) jet of 20–50 μm in diameter. A 50–100-μm diameter metal wire inserted in the nozzle was melted or evaporated efficiently at a few tens of watts by inductive heating as well as heat conduction from the microplasma and the resulting atomized droplets were jetted out with plasma-gas flowing. Most of the sprayed grains were oxidized during the processing and a deposit composed of metal oxide grains built up locally on the polymeric substrate. Because of the low heat flux due to small plasma size and low energy supply, this spraying is useful for deposition on low melting-point polymeric substrates. Additionally, the feasibility of line drawing with micron-width was demonstrated by linear translation of the substrate.