Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding
Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding
复制标题
使用镀镍显着减少焊线偏移，实现超细间距焊线
DOI：
10.1109/ectc.2002.1008205
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
K. Tatsumi
中科院分区：
文献类型：
--
作者：
S. Terashima;Y. Yamamoto;T. Uno;K. Tatsumi
提出了显著减少成型中的引线扫描，因为引线扫描被认为是实现具有小于30微米的超细间距的引线键合的主要问题。在本提议中，在键合的Au线上模制之前，Ni被镀上几微米。在保持在358 K的含有Ni和P的水溶液中通过化学镀进行Ni镀覆几分钟。（总直径为21微米）几乎是直径为15微米的Au线的一半，并且稍小于直径为25微米的Au线（除了Ni板之外），即使总直径更小。据认为，该技术的线扫描抑制是由于弹性和塑性性能的增强。
Significant reduction of the wire sweep in molding is proposed because the wire sweep is considered to be the major problem to realise wire bonding with ultra fine pitches of under 30 micrometers. In the present proposal, Ni was plated for several micrometers before molding on bonded Au wires. Ni plating was carried out by means of electroless plating for several minutes in the aqueous solution kept at 358 K containing Ni and P. The wire sweep ratio for Ni plated wire (total diameter was 21 micrometers) was almost half of that for Au wire with the diameter of 15 micrometers except Ni plate, and was slightly smaller than that for Au wire with the diameter of 25 micrometers except Ni plate even the total diameter was smaller. It is considered that wire sweep suppression by this technique was due to the enhancement of both elastic and plastic properties.