Origin of the superior adhesive performance of mushroom-shaped microstructured surfaces
Origin of the superior adhesive performance of mushroom-shaped microstructured surfaces
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DOI：
10.1039/c0sm01482f
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发表时间：
2011-01-01
期刊：
影响因子：
3.4
通讯作者：
Gorb, Stanislav N.
中科院分区：
文献类型：
--
作者：
Carbone, Giuseppe;Pierro, Elena;Gorb, Stanislav N.
壁虎、蜘蛛和昆虫等生物附着系统具有极好的粘附性，这激发了来自不同领域(如生物学、物理学和工程学)的研究人员构思和设计人造微结构表面，以模仿它们的性能。在提出的几种设计中，最近蘑菇状粘结剂微结构引起了科学家和工程师的兴趣，因为实验证明了它们相对于其他微结构和纳米结构的优越性。在这篇文章中，我们从理论上解释了这种微结构增强粘接的物理机制，并首次提供了一种有用的工具，可以根据材料的几何形状、力学性能和粘接能量来预测粘接性能。我们的理论预测得到了现有实验数据的有力支持。本研究可以优化工业应用中的胶粘剂微结构。
The superlative adhesive properties of some biological attachment systems, such as those of geckos, spiders, and insects, have inspired researchers from different fields (e.g. biology, physics and engineering) to conceive and design man-made microstructured surfaces that might mimic their performance. Among the several proposed designs, very recently mushroom-shaped adhesive microstructures have drawn the interest of scientists and engineers, because experiments have proved their superiority compared to other micro-and nano-structures. In this article, we explain theoretically the physical mechanism behind the enhanced adhesion of such microstructures, and provide for the first time a useful tool to predict adhesive performance depending on the geometry, mechanical properties of the material, and energy of adhesion. Our theoretical predictions are strongly supported by the available experimental data. The present study can streamline the optimisation of adhesive microstructures for industrial applications.