Epoxy Resin-Inspired Reconfigurable Supramolecular Networks
Epoxy Resin-Inspired Reconfigurable Supramolecular Networks
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DOI：
10.1021/acs.macromol.6b01491
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发表时间：
2016-10-25
期刊：
影响因子：
5.5
通讯作者：
de Espinosa, Lucas Montero
中科院分区：
文献类型：
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作者：
Balkenende, Diederik W. R.;Olson, Rebecca A.;de Espinosa, Lucas Montero
为了将可重构超分子聚合物的机械性能推向热固性树脂的机械性能，我们制备并研究了一种新的氢键聚合物网络，该网络由丙烯酸封端的低聚物（双酚A-co-环氧氯丙烷）和不同的联吡啶组装而成。这些材料显示高达3.9 GPa的高储能模量，可在加热时分解形成粘度低至2.1 Pa.s的熔体，并在冷却时完全重新组装。我们表明，新的聚合物可以很容易地重新配置，再加工，或回收，可逆（反）组装，使他们有用的热熔胶，允许剥离的需求。
With the goal to push the mechanical properties of reconfigurable supramolecular polymers toward those of thermoset resins, we prepared and investigated a new family of hydrogen-bonded polymer networks that are assembled from isophthalic acid-terminated oligo(bisphenol A-co-epichlorohydrin) and different bipyridines. These materials display high storage moduli of up to 3.9 GPa, can be disassembled upon heating to form melts with a viscosity of as low as 2.1 Pa.s, and fully reassemble upon cooling. We show that the new polymers can readily be reconfigured, reprocessed, or recycled and that the reversible (dis)assembly makes them useful as hot-melt adhesives that permit debonding on demand.