The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
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DOI：
10.1016/j.microrel.2015.10.007
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发表时间：
2016-01-01
影响因子：
1.6
通讯作者：
List-Kratochvil, E. J. W.
中科院分区：
文献类型：
--
作者：
Glushko, O.;Cordill, M. J.;List-Kratochvil, E. J. W.
系统研究了拉伸和压缩循环弯曲应变对聚萘二甲酸乙二醇酯基材上喷墨印刷和蒸发导电银线的机械可靠性的影响。借助新型弯曲测试设备，结果表明循环拉伸、压缩和混合拉伸压缩弯曲应变会导致印刷银线产生不同程度的机械损伤。相比之下，具有相同几何形状的蒸发银线显示出与应变类型无关。使用扫描电子显微镜和聚焦离子束分析对印刷银和蒸发银的断裂机制进行了详细比较。 (C) 2015 Elsevier Ltd. 保留所有权利。
Systematic investigation of the effect of tensile and compressive cyclic bending strains on the mechanical reliability of inkjet printed and evaporated conductive silver lines on polyethylene naphthalate substrates is presented. With the help of a new bending test apparatus it is shown that cyclic tensile, compressive, and mixed tensile compressive bending strains result in different amounts of induced mechanical damage in printed silver lines. In contrast, evaporated silver lines with the same geometry show no dependence on the type of strain. A detailed comparison of the fracture mechanisms in printed and evaporated silver is given using scanning electron microscopy and focused ion beam analysis. (C) 2015 Elsevier Ltd. All rights reserved.