Terahertz topological photonic integrated circuits for 6G and beyond: A Perspective
Terahertz topological photonic integrated circuits for 6G and beyond: A Perspective
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DOI：
10.1063/5.0099423
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发表时间：
2022-10-14
影响因子：
3.2
通讯作者：
Singh, Ranjan
中科院分区：
文献类型：
--
作者：
Kumar, Abhishek;Gupta, Manoj;Singh, Ranjan
太赫兹集成电路的发展对于实现第六代（6G）无线通信、高速片上互连、高分辨率成像、片上生物传感器和指纹化学检测至关重要。然而，现有的太赫兹片上器件在急转弯或缺陷处受到反射和散射损失的影响。最近发现的光的拓扑相位赋予光子器件非凡的特性，如无反射传播和对杂质或缺陷的鲁棒性，这对太赫兹集成器件至关重要。利用拓扑边缘状态的鲁棒性与低损耗硅平台相结合，将为太赫兹器件提供卓越的性能，为太赫兹集成电路和高速互连领域提供突破。从这个角度来看，我们简要介绍了由光子拓扑绝缘体实现的各种太赫兹功能器件，这将为互补金属氧化物半导体兼容太赫兹技术的增强铺平道路，这对于加速6G通信的愿景至关重要，并且可以实现无处不在的连接和物理和生物世界的大规模数字克隆。由AIP出版社独家授权出版。
The development of terahertz integrated circuits is vital for realizing sixth-generation (6G) wireless communication, high-speed on-chip interconnects, high-resolution imaging, on-chip biosensors, and fingerprint chemical detection. Nonetheless, the existing terahertz on-chip devices suffer from reflection, and scattering losses at sharp bends or defects. Recently discovered topological phases of light endow the photonics devices with extraordinary properties, such as reflectionless propagation and robustness against impurities or defects, which is vital for terahertz integrated devices. Leveraging the robustness of topological edge states combined with a low-loss silicon platform is poised to offer a remarkable performance of the terahertz devices providing a breakthrough in the field of terahertz integrated circuits and high-speed interconnects. In this Perspective, we present a brief outlook of various terahertz functional devices enabled by a photonic topological insulator that will pave the path for augmentation of complementary metal oxide semiconductor compatible terahertz technologies, essential for accelerating the vision of 6G communication and beyond to enable ubiquitous connectivity and massive digital cloning of physical and biological worlds. Published under an exclusive license by AIP Publishing.