Effect of extrusion temperature on the microstructure and thermal conductivity of Mg-2.0Zn-1.0Mn-0.2Ce alloys
Effect of extrusion temperature on the microstructure and thermal conductivity of Mg-2.0Zn-1.0Mn-0.2Ce alloys
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DOI：
10.1016/j.matdes.2015.08.043
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发表时间：
2015-12-15
影响因子：
8.4
通讯作者：
Pan, Fusheng
中科院分区：
文献类型：
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作者：
Peng, Jian;Zhong, Liping;Pan, Fusheng
研究了挤压温度对Mg-2.0Zn-1.0Mn-0.2Ce合金显微组织和热导率的影响。在室温下使用闪光法测量合金的热导率。结果表明，随着挤压温度的升高，未再结晶晶粒的体积分数逐渐减小，再结晶晶粒的平均晶粒尺寸逐渐增大。Mg-2.0Zn-1.0Mn-0.2Ce合金的热导率在挤压温度从340 ℃升高到400 ℃时先增大后减小，达到最大值131 W/（m.K），当挤压温度进一步升高到430 ℃时，热导率减小到125 W/（m.K）。所获得的最大导热系数满足LED灯镁合金散热模块的要求。在低于400摄氏度的挤压温度下保持大约59 HV的显微硬度，而当合金在430摄氏度挤压时，其急剧增加到74.0 HV。挤压温度改变了挤压态合金的微观组织和元素固溶，综合影响挤压态合金的导热性能。(C)2015爱思唯尔有限公司版权所有。
This study investigated the effect of extrusion temperature on the microstructure and thermal conductivity of Mg-2.0Zn-1.0Mn-0.2Ce. The thermal conductivity of the alloy was measured using the flash method at room temperature. Results indicated that the volume fraction of un-recrystallized grains decreased and the average grain size of recrystallized grains gradually increased with increasing extrusion temperature. The thermal conductivity of Mg-2.0Zn-1.0Mn-0.2Ce alloys initially increased, reached the maximum value of 131 W/(m.K) when the extrusion temperature increased from 340 degrees C to 400 degrees C, and then decreased to 125 W/(m.K) when the extrusion temperature further increased to 430 degrees C. The obtained maximum thermal conductivity meets the requirement for Mg alloy radiating module of LED lights. A micro-hardness of approximately 59 HV is maintained at extrusion temperature lower than 400 degrees C, while it sharply increases up to 74.0 HV when the alloy is extruded at 430 degrees C. The extrusion temperature changes the microstructure and solid solution of elements, which comprehensively affect the thermal conductivity of as-extruded alloys. (C) 2015 Elsevier Ltd. All rights reserved.