Experimental and Modelling Investigation of Re-Adhesion Mechanism of Detached Nanoparticles to Wafer Surface in Spin Rinse Process
Experimental and Modelling Investigation of Re-Adhesion Mechanism of Detached Nanoparticles to Wafer Surface in Spin Rinse Process
复制标题
旋转冲洗过程中分离的纳米粒子对晶圆表面的再粘附机制的实验和模型研究
DOI：
10.1149/2162-8777/ab9fe9
复制
发表时间：
2020
影响因子：
2.2
通讯作者：
A. Yano
中科院分区：
文献类型：
--
作者：
N. Handa;H. Hiyama;K. Amagai;A. Yano
抛光晶片上的粘性颗粒通过例如擦洗来分离，并通过从晶片中流出的液体来去除。然而，液体流动特性与分离颗粒的去除之间的关系还没有得到详细的研究。因此，本文对旋转硅片上液流中脱落颗粒与晶片表面的再粘合进行了实验研究。在去离子水(DIW)漂洗去除颗粒后，使用缺陷检测工具对晶片上的残留颗粒数量进行计数。为了探讨颗粒去除的机理，建立了模型，并与实验结果进行了比较。该模型基于流体力学中的边界层理论和关于晶片表面附近液体流动中颗粒迁移现象的平流扩散理论。模型结果证实，液流中分离的颗粒进入晶片底层，并通过扩散重新附着在晶片表面。此外，当液体速度为几百微米/S时，亚层中的粒子不能从亚层中移动和从晶片中移除。研究还发现，晶片表面重新附着的颗粒数量与舍伍德数有关。
Adhesive particles on polished wafers are detached by eg scrubbing, and removed by liquid flow from the wafer. However, the relationship between the characteristic of liquid flow and the removal of detached particles has not yet been examined in detail. Therefore, the re-adhesion of detached particles to wafer surfaces in liquid flow on rotating wafers was experimentally investigated. The number of residue particles on a wafer was counted using a defect inspection tool after de-ionized water (DIW) rinse for particle removal. To discuss the mechanism of particle removal, a model was constructed and compared with experimental results. The model is based on boundary layer theory of fluid dynamics and advection diffusion theory of transport phenomena for particle removal in liquid flow near the wafer surface. The model results confirmed that detached particles in liquid flow moved into the sublayer and re-adhered to the wafer surface by diffusion. Moreover, particles in the sublayer, where the liquid velocity is several hundred um/s, could not be moved from the sublayer and removed from the wafer. It was also found that the number of particles re-adhering to the wafer surface depends on the Sherwood number.