Development of Novel MEMS Soldering Technique Using Self-Propagating Exothermic Reaction in Al/Ni Multilayer Films
Development of Novel MEMS Soldering Technique Using Self-Propagating Exothermic Reaction in Al/Ni Multilayer Films
复制标题
利用 Al/Ni 多层膜中自蔓延放热反应开发新型 MEMS 焊接技术
DOI：
10.2472/jsms.56.932
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
S. Inoue
中科院分区：
文献类型：
--
作者：
H. Fujita;T. Namazu;S. Inoue
本文介绍了一种用于 MEMS 焊接技术的新型局部热处理技术。直流磁控溅射沉积的Al/Ni多层薄膜表现出自蔓延放热反应。通过向反应薄膜施加火花，薄膜产生足够的热量来熔化金锡焊料薄膜。反应热取决于 Al/Ni 双层厚度和总膜厚度。我们使用 Al/Ni 多层薄膜作为 MEMS 焊接封装中的局部热源。在没有其他外部热源的情况下，通过局部加热制备了 Au-Sn 焊料薄膜键合的硅元件，并表征了键合强度。通过 Al/Ni 多层薄膜的放热反应进行的局部加热技术可能具有用于 MEMS 焊接技术的潜力。
This paper describes a novel local heat process technique for MEMS soldering technology. Al/Ni multilayer film deposited by DC magnetron sputtering shows self-propagating exothermic reaction. By applying a spark to the reactive film, the film generates heat enough to melt Au-Sn solder film. The heat of reaction depended on Al/Ni bilayer thickness and the total film thickness. We used the Al/Ni multilayer film as a local heat source in MEMS soldering packages. Au-Sn solder film-bonded silicon elements by the local heating was fabricated without other external heat sources, and the bond strength was characterized. The local heating technique by Al/Ni multilayer film's exothermic reaction would likely have the potential for MEMS soldering technology.