Application of thermal analysis in the study of alkyd-allyl moulding compounds
Application of thermal analysis in the study of alkyd-allyl moulding compounds
复制标题
DOI：
10.1007/bf02188849
复制
发表时间：
1984-09-01
影响因子：
3.100
通讯作者：
W. Królikowski
中科院分区：
文献类型：
--
作者：
M. I. Strumik;W. Królikowski
以邻苯二甲酸二烯丙酯为网络单体，与其他5种不饱和聚酯树脂组成的醇酸-烯丙基模塑料进行了差热分析。通过对DTA曲线的分析，可以选择在所研究单体中形成固化良好的模塑化合物的醇酸。固化样品的耐热性和丙酮吸收率证实了醇酸的选择。用差热分析(DTA)研究了6种不同的粉末填料对烷基烯丙基模塑料固化放热效果的影响。
Alkyd-allyl moulding compounds containing diallyl orthophthalate as networking monomer and five other unsaturated polyester resins were investigated by DTA. Analysis of DTA curves allowed choice of the alkyds forming well-cured moulding compounds within the investigated monomer. The thermal resistance and acetone absorption of the cured sample confirmed the choice of the alkyd. The influence of 6 different powder fillers on the exothermic effect of curing of alkydallyl moulding compounds was evaluated by DTA.