Research on defects inspection of solder balls based on eddy current pulsed thermography.
Research on defects inspection of solder balls based on eddy current pulsed thermography.
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DOI：
10.3390/s151025882
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发表时间：
2015-10-13
期刊：
影响因子：
--
通讯作者：
Wang Y
中科院分区：
文献类型：
--
作者：
Zhou X;Zhou J;Tian G;Wang Y
为了解决高密度倒装焊焊球微小缺陷的检测问题，提出了基于涡流脉冲热成像技术（ECPT）的检测能力影响及分类的可行性研究。具体而言，三维有限元感应加热模型的数值分析产生的不同类型的缺陷，如裂纹，空洞等，对温度场的干扰有缺陷的和无缺陷的焊球之间的温度变化进行监测，缺陷识别和分类。最后，对直径为1mm的微小锡球进行了ECPT实验研究，验证了该技术的有效性。
In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat model is generated to investigate disturbance on the temperature field for different kind of defects such as cracks, voids, etc. The temperature variation between defective and non-defective solder balls is monitored for defects identification and classification. Finally, experimental study is carried on the diameter 1mm tiny solder balls by using ECPT and verify the efficacy of the technique.