Sweat effects on the thermal analysis of epidermal electronic devices integrated with human skin
Sweat effects on the thermal analysis of epidermal electronic devices integrated with human skin
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DOI：
10.1016/j.ijheatmasstransfer.2018.07.105
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发表时间：
2018-12
影响因子：
5.2
通讯作者：
Yun Cui;Yuhang Li;Y. Xing
中科院分区：
文献类型：
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作者：
Yun Cui;Yuhang Li;Y. Xing
表皮电子器件（EEDs）被广泛应用于许多应用中，特别是直接与人体皮肤组织集成以监测人体的生命体征。EED的热管理非常关键，因为温度过度升高可能会导致人体皮肤不适或损伤。出汗也可以显着改变EED/皮肤系统的热环境，由于其在热传输过程中的作用。考虑生物传热和显汗的影响，建立了电火工品/皮肤系统的三维传热分析模型，预测了电火工品/皮肤系统的热特性。在该模型中，EEDs和人体皮肤的热传导分别考虑傅立叶传热方程和Pennes生物传热方程，包括出汗的传输过程。通过有限元分析（FEA）和参数研究，如汗液的速度，导热系数和基板厚度的结果进行了验证。研究结果可为考虑感汗影响的电火工品/皮肤系统热管理提供指导。
Epidermal electronic devices (EEDs) are widely used in many applications especially directly integrated with human skin tissue to monitor the vital signs of human body. The thermal management of EEDs is very critical because the excessive temperature increase may cause discomfort or damage to human skin. Sweating can also significantly change the thermal environment of EED/skin system due to its function on the thermal transport process. A three-dimensional heat transfer analytical model is established to predict the thermal characteristics of EED/skin system considering the bio-heat transfer and effects of sensible sweat. In this model, the heat conductions in EEDs and in human skin are taken into account with Fourier heat transfer equation and Pennes bio-heat transfer equation, respectively, including the transport process of sweating. The results are validated by finite element analysis (FEA) and parameters studies such as velocity of sweat, thermal conductivity and thickness of substrate have been investigated. The results can help guide the thermal management of EED/skin system considering effects of sensible sweat.