SIMULTANEOUS DEPOSITION OF PD AND AG ON POROUS STAINLESS-STEEL BY ELECTROLESS PLATING
SIMULTANEOUS DEPOSITION OF PD AND AG ON POROUS STAINLESS-STEEL BY ELECTROLESS PLATING
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DOI：
10.1016/0376-7388(93)85068-8
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发表时间：
1993-03-04
影响因子：
9.5
通讯作者：
KALIAGUINE, S
中科院分区：
文献类型：
--
作者：
SHU, J;GRANDJEAN, BPA;KALIAGUINE, S
研究了多孔不锈钢表面化学镀钯和银的共沉积行为。虽然钯和银可以独立地沉积到相当大的厚度，但是钯和银的同时沉积通过在含有EDTA作为络合剂的无电镀浴中优先沉积银而钝化。在通过Pd预沉积有效活化基底之后，Pd和Ag可以成功地共沉积。XRD和EDX分析的组合揭示，共沉积的Pd和Ag是在单独的阶段，少量的无定形富钯相也存在于沉积的材料。提出了钯银共沉积机理。在H2气氛中对沉积的Pd-Ag薄膜进行热处理，在多孔不锈钢基底上形成复合Pd-Ag合金膜。
This work investigates the codeposition behavior of palladium and silver on porous stainless steel by means of electroless plating. Although palladium and silver can be deposited independently to a considerable thickness, simultaneous deposition of palladium and silver is passivated by the preferential deposition of silver in an electroless bath containing EDTA as a complexing agent. After effective activation of the substrate by Pd predeposition, Pd and Ag can be successfully codeposited. A combination of XRD and EDX analyses reveals that codeposited Pd and Ag are in separate phases and that small amounts of an amorphous palladium rich phase are also present in the deposited material. Thus a codeposition mechanism of Pd and Ag is proposed. Thermal treatment of as-deposited Pd-Ag films in H-2 atmosphere provides composite Pd-Ag alloy membranes on the porous stainless steel substrate.