Test challenges for deep sub-micron technologies
Test challenges for deep sub-micron technologies
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DOI：
10.1109/dac.2000.855293
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发表时间：
2000-06
期刊：
影响因子：
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通讯作者：
K. Cheng;S. Dey;M. Rodgers;K. Roy
中科院分区：
文献类型：
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作者：
K. Cheng;S. Dey;M. Rodgers;K. Roy
深亚微米工艺技术的应用对制造测试提出了新的挑战。虽然大量的工作致力于识别和调查纳米技术的设计挑战，但对测试策略和方法的影响仍然没有得到很好的理解。本文重点介绍了技术驱动的趋势所带来的挑战，目前的测试方法，并将提出一个概述新兴技术，解决深亚微米测试的挑战。
The use of deep submicron process technologies presents several new challenges in the area of manufacturing test. While a significant body of work has been devoted to identifying and investigating design challenges in nanometer technologies, the impact on test strategies and methodologies is still not well understood. This paper highlights the challenges to current test methodologies arising from technology driven trends, and will present an overview of emerging techniques that address deep submicron test challenges.