SiGe HBTs featuring fT ≫400GHz at room temperature

SiGe HBTs featuring fT ≫400GHz at room temperature
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SiGe HBT 在室温下具有 fT ≫400GHz

DOI:
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发表时间:
2008
期刊:
2008 IEEE Bipolar/BiCMOS Circuits and Technology Meeting
影响因子:
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通讯作者:
A. Chantre
A. Chantre
中科院分区:
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文献类型:
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作者:
B. Geynet;P. Chevalier;B. Vandelle;F. Brossard;N. Zerounian;M. Buczko;D. Gloria;F. Aniel;G. Dambrine;F. Danneville;D. Dutartre;A. Chantre

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本文介绍了减少工艺热预算,以提高SiGe HBT的工作频率的调查结果。我们描述了器件的直流和交流特性随尖峰退火温度的变化。在室温和低温下分别报告了410 GHz和640 GHz的记录峰值fT值。
This paper presents the results of investigations on process thermal budget reduction in order to increase the operation frequency of SiGe HBTs. We describe the variations of DC and AC characteristics of the devices with the spike annealing temperature. Record peak fT values of 410 GHz and 640 GHz are reported at room and cryogenic temperatures respectively.