Microstructure-based 3D Finite Element Model for Micro Drilling Carbon Steels
Microstructure-based 3D Finite Element Model for Micro Drilling Carbon Steels
复制标题
用于微钻孔碳钢的基于微观结构的 3D 有限元模型
DOI：
10.1016/j.procir.2013.06.071
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
Veselovac
中科院分区：
文献类型：
--
作者：
Abouridouane;Klocke;Veselovac
众所周知，微观结构控制着材料的物理性能和热机械行为。由于材料微观结构的复杂性，通常很难用解析或数值模拟技术来模拟材料在加工过程中的行为。基于代表性体积元的概念和本构材料模型，提出了一种将微观结构引入微切削仿真的三维有限元方法。为此，采用了隐式有限元程序DEFORM-3DTM中提出的拉格朗日格式。为了验证所建立的三维多相有限元计算模型，对C05、C45和C75三种铁素体珠光体碳钢进行了不同直径的整体硬质合金麻花钻(d=100μm-1 mm)的微钻削试验。基于微观结构的三维有限元模型在切屑形成、进给力和扭矩方面得到了成功的验证。在微钻孔试验中确定的尺寸效应也可以得到现实的预测。
It is well recognized that microstructure controls the physical properties and thermo-mechanical behaviour of a material. The complexity of the microstructure often makes it very difficult to simulate the material behavior in cutting processes using analytical or numerical modeling techniques. This paper presents a three-dimensional finite element approach to incorporate microstructure into micro cutting simulation based on the concept of a representative volume element (RVE) and constitutive material modeling. For this purpose, the Lagrangian formulation proposed in the implicit FE code Deform 3DTMwas applied. Micro drilling tests with solid carbide twist drills in different diameters (d = 100 μm - 1 mm) were performed on ferritic-pearlitic carbon steels C05, C45 and C75 for the verification of the developed 3D multiphase FE computation model. The microstructure-based 3D FE model was successfully validated regarding chip formation, feed force, and torque. A realistic prediction of size effects identified in micro drilling tests could also be obtained.
用于微切削铁素体珠光体碳钢的新 3D 多相有限元模型
影响因子：
4.1
作者：
Abouridouane;Klocke
通讯作者：
Klocke
DOI：
10.4028/www.scientific.net/amr.223.20
发表时间：
2011-04
期刊：
Advanced Materials Research
影响因子：
--
作者：
V. Schulze;F. Zanger;Jürgen Michna;Florian Ambrosy;R. Pabst
通讯作者：
V. Schulze;F. Zanger;Jürgen Michna;Florian Ambrosy;R. Pabst
通过微观结构级有限元仿真模型进行机械切削过程校准
DOI：
10.1115/1.1813480
发表时间：
2004
影响因子：
4
作者：
Sunghyuk Park;S. Kapoor;R. DeVor
通讯作者：
R. DeVor