Improving sidewall roughness by combined RIE-Bosch process
Improving sidewall roughness by combined RIE-Bosch process
复制标题
通过 RIE-Bosch 组合工艺提高侧壁粗糙度
DOI：
10.1016/j.mssp.2018.04.033
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发表时间：
2018-08-15
影响因子：
4.1
通讯作者：
Chen, Dapeng
中科院分区：
文献类型：
--
作者：
Fu, Jianyu;Li, Junjie;Chen, Dapeng
提出了一种提高高纵横比沟槽侧壁粗糙度的方法。该方法利用博世工艺中纵横比相关的扇贝衰减（ARDSA）效应，采用反应离子蚀刻（RIE）工艺避免了沟槽顶部的波纹侧壁，同时随着沟槽深度的增加保留了博世工艺。由于RIE和Bosch工艺都是公认的生产技术，因此该方法易于实施。与标准Bosch工艺相比，侧壁的最大均方根粗糙度（RMS）由15.1 nm降至6.89 nm。
An approach for improving sidewall roughness of high-aspect-ratio trench is developed. This method relies on the aspect ratio dependent scalloping attenuation (ARDSA) effect in Bosch process, employs reactive ion etching (RIE) process to avoid the rippled sidewall at the top of the trench, while retains Bosch process with increasing trench depth. As both the RIE and Bosch processes are recognized production techniques, this method is easy to implement. Compared with standard Bosch process, the maximum root mean square (RMS) roughness of the sidewall is brought down from 15.1 nm to 6.89 nm.