Push-pull process for contact defect-free patterning in reverse offset printing

Push-pull process for contact defect-free patterning in reverse offset printing
复制标题

反向胶印中无接触缺陷图案的推拉工艺

DOI:
10.1088/2058-8585/aa5164
复制
发表时间:
2016
影响因子:
3.1
通讯作者:
H. Ushijima
H. Ushijima
中科院分区:
工程技术4区
文献类型:
--
作者:
Y. Kusaka;K. Sugihara;H. Ushijima

文献摘要

参考文献

被引文献

相似文献

反向胶印是印刷电子产品最有前途的印刷技术之一,因为它使我们能够产生高保真的精细图案。然而,在图案生成过程中,其中施加在橡皮布上的一些油墨在接触时被铅版去除,由于铅版的底部区域和橡皮布之间的不期望的接触,可能存在接触缺陷形成。这可能发生在图案尺寸较宽或铅版深度较浅时。为了解决这个问题,我们开发了一种修改后的打印协议,该协议采用了称为“推拉”过程的“负”打印压力条件。在这个过程中,橡皮布首先通过推动橡皮布滚筒与铅版接触,然后将滚筒拉回,以防止橡皮布压入铅版的凹槽中。通过将推拉工艺结合到反向胶印中,我们展示了使用深度为2.6 μ m的浅铅版形成4.0 mm × 5.0 mm大图案的无缺陷形成,这是传统的仅推工艺无法实现的。此外,我们表明,油墨涂层的橡皮布和铅版之间的粘附力有助于通过印刷过程中的接触的维护,即使在拉的情况下。
Reverse offset printing is one of the most promising printing techniques for printed electronics because it enables us to generate fine patterns with high fidelity. However, in the pattern-generation process, where some of the ink applied on a blanket is removed by a cliché upon contact, there may be contact-defect formations due to unwanted contact between the bottom regions of the cliché and the blanket. This may occur when the pattern size is wide or when the depth of the cliché is shallow. To solve this problem, we develop a modified printing protocol that adopts a ‘negative’ printing pressure condition called a ‘push-pull’ process. In this process, the blanket first comes into contact with the cliché by pushing a blanket roller, and the roller is then pulled back to prevent the blanket indentation into the grooves of the cliché. By incorporating the push-pull process in reverse offset printing, we demonstrate defect-free formations of 4.0 mm × 5.0 mm large patterns using a shallow cliché with a depth of 2.6 μm, which is unattainable with the conventional push-only process. Further, we show that the adhesion between the ink-coated blanket and the cliché contributes to the maintenance of the contact through the printing process, even in the pull situation.
DOI: 10.1016/s0021-9797(03)00217-0
发表时间: 2003-07
影响因子: 9.9
作者:
Y. Masuda;T. Koumura;T. Okawa;K. Koumoto
通讯作者: Y. Masuda;T. Koumura;T. Okawa;K. Koumoto