Preparation and supercapacitive property of molybdenum disulfide (MoS2) nanoflake arrays- tungsten trioxide (WO3) nanorod arrays composite heterojunction: A synergistic effect of one-dimensional and two-dimensional nanomaterials

Preparation and supercapacitive property of molybdenum disulfide (MoS2) nanoflake arrays- tungsten trioxide (WO3) nanorod arrays composite heterojunction: A synergistic effect of one-dimensional and two-dimensional nanomaterials
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二硫化钼(MoS2)纳米片阵列-三氧化钨(WO3)纳米棒阵列复合异质结的制备及其超电容性能:一维和二维纳米材料的协同效应

DOI:
10.1016/j.electacta.2018.01.072
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发表时间:
2018-02-10
影响因子:
6.6
通讯作者:
Bashir, Sajid
Bashir, Sajid
中科院分区:
材料科学2区
文献类型:
--
作者:
Gong, Hanqin;Zheng, Feng;Bashir, Sajid

文献摘要

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我们首先报道了一种直接生长在铜衬底上的二硫化钼(MoS 2)纳米片阵列(MNF)和三氧化钨(WO 3)纳米棒阵列(WNR)的复合材料。通过扫描电镜、透射电镜(SEM/TEM)、X射线衍射(XRD)、拉曼光谱(Raman)和X射线光电子能谱(XPS)对复合材料进行了表征。所有的证据表明,所获得的复合材料是一个异质结。采用循环伏安法(CV)、恒流充放电(GCD)和电化学阻抗谱(EIS)等技术系统地研究了MNF s-WNR复合异质结的超电容性能。该异质结在0.5 A g(-1)下具有522 F g(-1)的高比电容,5000次循环后的高电容保持率(95%)和低电荷转移电阻(1.0 Ω)。这种异质结兼有MoS 2和WO 3的优点,是一种较好的超级电容电极材料。(c)2018爱思唯尔有限公司版权所有
We first report a composite of molybdenum disulfide (MoS2) nanoflake arrays (MNFs) and tungsten trioxide (WO3) nanorod arrays (WNRs) directly grown on a copper (Cu) substrate. This composite is characterized in detail by scanning and transmission electron microscopes (SEM/TEM), X-ray diffraction (XRD), Raman and X-ray photoelectron spectroscopy (XPS). All of the evidences indicate that the obtained composite is a heterojunction. The supercapacitive properties of MNFs-WNRs composite heterojunction are measured systematically by using cyclic voltammetry (CV), galvanostatic charge-discharge (GCD) and electrochemical impedance spectroscopy (EIS) techniques. The heterojunction exhibits a high specific capacitance of 522 F g(-1) at 0.5 A g(-1), a high capacitance retention (95%) after 5000 cycles and a low charge transfer resistance (1.0 Omega). And this kind of heterojunction has advantages of both MoS2 and WO3, which can be a better candidate for supercapacitive electrode material. (c) 2018 Elsevier Ltd. All rights reserved.