Direct Bonding to Aluminum with Silver-Oxide Microparticles
Direct Bonding to Aluminum with Silver-Oxide Microparticles
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DOI：
10.2320/matertrans.mrp2008277
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发表时间：
2009-01-01
影响因子：
1.2
通讯作者：
Hirose, Akio
中科院分区：
文献类型：
--
作者：
Morita, Toshiaki;Yasuda, Yusuke;Hirose, Akio
该研究表明，通过使用添加了乙酸银的银氧化物颗粒，随后在2.5 MPa的压力下在350 ℃的空气中加热，电极与铝之间直接结合。过去，通过使用包含锡、铅等的焊料材料与铝直接接合是不可能的。我们认为这种技术在银和通过乙酸氧化过程中产生的燃烧热（其通过加热时乙酸银的分解产生）在铝表面上形成的自然氧化物膜之间产生强结合。[doi：10.2320/matertrans.MRP2008277]
This study demonstrated that direct bonding between electrode and aluminum by using silver oxide particles which added acetic acid silver, followed by heating in air at 350 degrees C under a pressure of 2.5 MPa. Direct bonding with aluminum by using solder materials containing tin, lead, or the like has been impossible in the past. We think this technique creates strong bonding between silver and the natural oxide film formed on an aluminum surface by the combustion heat generated during oxidation of acetic acid (which is generated by decomposition of the silver acetate as it is heated). [doi: 10.2320/matertrans.MRP2008277]