The influence of target surface morphology on the deposition flux during direct-current magnetron sputtering
The influence of target surface morphology on the deposition flux during direct-current magnetron sputtering
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DOI：
10.1016/j.tsf.2012.11.097
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发表时间：
2013-03-15
期刊：
影响因子：
2.1
通讯作者：
Depla, D.
中科院分区：
文献类型：
--
作者：
Boydens, F.;Leroy, W. P.;Depla, D.
通过比较固体靶和压制粉末靶，研究了靶表面形貌对溅射沉积通量和能通量的影响。两种靶类型之间的有效溅射产率的显著的材料依赖性差异被注意到。这种差异被解释为结合两种效果：局部增加的元素溅射产率和溅射原子的再沉积到目标上。这两种效应强烈地依赖于目标表面形态。实验趋势再现Monte Carlo模拟。这允许描述溅射原子的角分布，其是定义到达衬底上的原子的粒子通量和能量分布的重要参数。使用以前开发的粒子轨迹代码SIMTRA，后者被证明为所研究的材料（铝，银，铜，钛）。(c)2012爱思唯尔有限公司版权所有。
The effect of the target surface morphology on the sputter deposition flux and the energy flux is investigated by comparing solid targets to pressed powder targets. A significant, material dependent difference of the effective sputter yield between both target types is noticed. This difference is explained by combining two effects: a local increase of the elemental sputter yield and the redeposition of sputtered atoms onto the target. Both effects strongly depend on the target surface morphology. The experimental trends are reproduced by Monte Carlo simulations. This allows a description of the angular distribution of the sputtered atoms which is an important parameter to define the particle flux and the energy distribution of the atoms arriving on the substrate. Using the previously developed particle trajectory code SIMTRA, the latter is demonstrated for the studied materials (Al, Ag, Cu, and Ti). (c) 2012 Elsevier B.V. All rights reserved.