Influence of crystallographic orientation on growth behavior of spherical voids
Influence of crystallographic orientation on growth behavior of spherical voids
复制标题
晶体取向对球形空隙生长行为的影响
DOI：
10.1007/s11771-008-0031-x
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发表时间：
2008
影响因子：
--
通讯作者：
L. Ye
中科院分区：
文献类型：
--
作者：
Xin;Wen;Jianguo Tang;L. Ye
采用含球形孔洞的三维晶胞，用三维晶体塑性有限元数值模拟了晶体取向对面心立方晶体中孔洞生长的影响，并将速率相关晶体塑性理论作为用户材料子程序实现。模拟结果表明，晶体取向对空穴的生长行为有显著影响。空洞周围区域不同的活动滑移系统导致空洞周围晶格旋转的不连续性，形成角状区域。在空洞位于晶界的情况下，两晶之间发生了较大的非均匀变形，当ϑ=45°(ϑ为晶界方向与X轴的夹角)时，空洞附近晶界的等效塑性变形较大。晶界取向因子相差较大，晶界等效塑性变形较大，晶胞更容易发生沿晶断裂。
The influence of crystallographic orientation on the void growth in FCC crystals was numerically simulated with 3D crystal plasticity finite element by using a 3D unit cell including a spherical void, and the rate-dependent crystal plasticity theory was implemented as a user material subroutine. The results of the simulations show that crystallographic orientation has significant influence on the growth behavior of the void. Different active slip systems of the regions around the void cause the discontinuity in lattice rotation around the void, and the corner-like region is formed. In the case of the void located at grain boundary, large heterogeneous deformation occurs between the two grains, and the equivalent plastic deformation along grain boundary near the void in the case of ϑ=45° (ϑ is the angle between grain boundary direction and X-axis) is larger than the others. Large difference of orientation factor of the two grains leads to large equivalent plastic deformation along grain boundary, and the unit cell is more likely to fail by intergranular fracture.