Development of underfilling and encapsulation for deep-ultraviolet LEDs
Development of underfilling and encapsulation for deep-ultraviolet LEDs
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DOI：
10.7567/apex.8.012101
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发表时间：
2014
影响因子：
2.3
通讯作者：
K. Yamada;Yuuta Furusawa;Shoko Nagai;A. Hirano;M. Ippommatsu;K. Aosaki;Naoki Morishima;H. Amano-H.-Am
中科院分区：
文献类型：
--
作者：
K. Yamada;Yuuta Furusawa;Shoko Nagai;A. Hirano;M. Ippommatsu;K. Aosaki;Naoki Morishima;H. Amano-H.-Am
目前可用于填充和封装的树脂仅限于波长大于约330 nm的波长，因为几乎所有的树脂都被深紫外光分解。氟树脂是深紫外光LED中可能的填充和封装材料，我们已经研究了使用这种树脂的填充和封装方法。此外，从光化学的角度研究了它们在265和285 nm波长下的耐久性，并提出了一种光学各向同性的稳定的无定形氟树脂。此外，还进行了用该树脂进行封装的试验。
The currently available resins for underfilling and encapsulation are limited to wavelengths longer than approximately 330 nm because almost all resins are decomposed by deep-ultraviolet light. Fluorine resins are possible materials for underfilling and encapsulation in deep-ultraviolet LEDs, and we have investigated methods of underfilling and encapsulation using such resins. Also, their durability at wavelengths of 265 and 285 nm has been studied from the photochemical viewpoint, and we propose a stable amorphous fluorine resin that is optically isotropic. Also, a trial of encapsulation using the resin has been made.