Effects of phenolic resin contents on microstructures and properties of c/sic‐diamond composites
Effects of phenolic resin contents on microstructures and properties of c/sic‐diamond composites
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DOI：
10.1111/jace.17639
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发表时间：
2021-02
影响因子：
3.9
通讯作者：
Jingxin Li;Yongsheng Liu;Chao Chen;Yu Pan;Jing Wang;Ning Wang
中科院分区：
文献类型：
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作者：
Jingxin Li;Yongsheng Liu;Chao Chen;Yu Pan;Jing Wang;Ning Wang
本文采用化学气相渗透（CVI）和反应熔体渗透（RMI）法制备了C/SiC-金刚石复合材料，研究了酚醛树脂含量对C/SiC-金刚石复合材料组织和性能的影响。结果表明，酚醛树脂含量对反应熔渗前复合材料的孔结构以及反应熔渗后基体的相组成和密度有显著影响。复合材料的力学性能与酚醛树脂的阈值效应有关。用高酚醛树脂含量制备的样品R5显示出显著下降的机械性能。另一方面，通过调整酚醛树脂的添加量，可以得到室温热导率最大为14.75W/（m·K）的样品。采用Hasselman约翰逊（H-J）理论模型计算了复合材料的理论导热系数，其值为24.52 W/（m·K）。总体而言，酚醛树脂含量的增加导致未反应的金刚石-C区域和大量孔隙的形成。这些特征降低了所得C/SiC-金刚石复合材料的热导率。
In this paper, C/SiC‐diamond composites were obtained by chemical vapor infiltration (CVI) and reactive melt infiltration (RMI), and the effects of phenolic resin contents on the microstructures and properties of as‐obtained C/SiC‐diamond composites were studied. The results suggested a significant influence of phenolic resin contents on the pore structure of the composites before reactive melt infiltration (RMI), as well as phase composition and density of the matrix after RMI. The mechanical properties of composites were shown to correlate with the threshold effect of phenolic resin. Sample R5 prepared with high phenolic resin contents displayed significantly declined mechanical properties. On the other hand, adjustment of the phenolic resin content yielded samples with maximum room temperature thermal conductivity reaching 14.75 W/(m·K). The theoretical thermal conductivity of the composites calculated by the Hasselman‐Johnson (H‐J) theoretical model was estimated to 24.52 W/(m·K). Overall, the increase in phenolic resin content led to unreacted diamond‐C regions and the formation of substantial porosity. These features reduced the thermal conductivity of the resulting C/SiC‐diamond composites.