3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities

3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities
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具有单向和双向功能的 3D 电容互连

DOI：
10.1109/isscc.2007.373441
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发表时间：
2007
期刊：
2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers
影响因子：
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通讯作者：
R. Guerrieri
R. Guerrieri
中科院分区：
--
文献类型：
--
作者：
A. Fazzi;R. Canegallo;L. Ciccarelli;L. Magagni;Federico Natali;E. Jung;P. Rolandi;R. Guerrieri

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基于电容耦合的无线互连方案为3D系统集成提供了单向和双向传输能力。芯片实现在0.13微米CMOS和组装面对面。RX-TX电路由8 × 8 μ m 2电极连接，这使得时钟在17 GHz的垂直传播，对于通用信号的传播延迟为420 ps，吞吐量超过22 MB/s/mum 2，能耗为0.08 pJ/B
A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum 2 electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum2 with 0.08pJ/b energy consumption