Prediction of the coefficient of linear thermal expansion for the amorphous homopolymers based on chemical structure using machine learning
Prediction of the coefficient of linear thermal expansion for the amorphous homopolymers based on chemical structure using machine learning
复制标题
使用机器学习根据化学结构预测非晶均聚物的线性热膨胀系数
DOI:
10.1080/27660400.2021.1993729
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发表时间:
2021
期刊:
影响因子:
--
通讯作者:
Nakata Ayako
中科院分区:
文献类型:
--
作者:
Gracheva Ekaterina;Lambard Guillaume;Samitsu Sadaki;Sodeyama Keitaro;Nakata Ayako
The coefficient of thermal expansion (CTE) is an industrially crucial macroscopic property of polymers. Yet, there is no structure-based model expressing it with sufficient accuracy. In this work, we present two data-driven predictive models for the linear CTE of amorphous homopolymers in the glassy state based solely on chemical structure, showing consistent predictions. The first model is built with the SMILES-X software and is based on the simplified molecular-input line-entry system (SMILES) of polymer’s repeating unit as input. The second model is built with a random forest trained on extended-connectivity fingerprints of repeating units. Both models are trained on 106 experimental data samples taken from the PoLyInfo database. The out-of-sample prediction shows a root-mean-square error of 2.65 ± 0.09 × 10–5K–1(2.58 ± 0.09 × 10–5K–1), a mean absolute error of 1.71 ± 0.06 × 10–5K–1(1.61 ± 0.06 × 10–5K–1) and a coefficient of determination of 0.62 ± 0.03 (0.64 ± 0.03) for SMILES-X (random forest). Additionally, the models are validated experimentally using a lab-prepared sample with good agreement (p-valuefor both models). The attention mechanism, incorporated into SMILES-X, points out salient SMILES substructures, and the resulting maps suggest that the model takes decisions on a chemically interpretable basis.Abbreviations:SMILES; CTE; CLTE; CVTE
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DOI:
--
发表时间:
2021
期刊:
arXiv.org
影响因子:
--
作者:
Ekaterina Gracheva
通讯作者:
Ekaterina Gracheva
影响因子:
5.5
作者:
P. S. Wilson;R. Simha
通讯作者:
R. Simha
影响因子:
13.6
作者:
Barnett, J. Wesley;Bilchak, Connor R.;Kumar, Sanat K.
通讯作者:
Kumar, Sanat K.
影响因子:
5.5
作者:
SIMHA, R;WILSON, PS
通讯作者:
WILSON, PS