Design of Accurate Low-Cost On-Chip Structures for Protecting Integrated Circuits Against Recycling
Design of Accurate Low-Cost On-Chip Structures for Protecting Integrated Circuits Against Recycling
复制标题
用于保护集成电路免遭回收的精确低成本片上结构设计
DOI：
10.1109/tvlsi.2015.2466551
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发表时间：
2016
影响因子：
2.8
通讯作者：
M. Tehranipoor
中科院分区：
文献类型：
--
作者：
Ujjwal Guin;Domenic Forte;M. Tehranipoor
电子元件的回收利用已成为工业和政府的主要关注点，因为它可能会影响各种电子系统的安全性和可靠性。检测已经使用了很短时间的回收集成电路（IC）是非常具有挑战性的，因为工艺变化超过了老化造成的退化，特别是在较低的技术节点。在本文中，我们提出了一套解决方案，基于轻量级的负偏置温度不稳定性（NBTI）感知环形振荡器（RO），用于打击芯片和IC回收（CCED）时，IC被使用了很短的时间。所提出的解决方案在90 nm技术节点中实现。仿真结果表明，我们新提出的NBTI感知的多对基于RO的CDIR可以检测仅使用了几个小时的IC。
The recycling of electronic components has become a major industrial and governmental concern, as it could potentially impact the security and reliability of a wide variety of electronic systems. It is extremely challenging to detect a recycled integrated circuit (IC) that is already used for a very short period of time because the process variations outpace the degradation caused by aging, especially in lower technology nodes. In this paper, we propose a suite of solutions, based on lightweight negative bias temperature instability (NBTI)-aware ring oscillators (ROs), for combating die and IC recycling (CDIR) when ICs are used for a very short duration. The proposed solutions are implemented in the 90-nm technology node. The simulation results demonstrate that our newly proposed NBTI-aware multiple pair RO-based CDIRs can detect ICs used only for a few hours.