Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications
Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications
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DOI：
10.1021/acsami.5b01341
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发表时间：
2015-05-06
影响因子：
9.5
通讯作者：
Yu, Jie
中科院分区：
文献类型：
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作者：
Li, Mingyu;Xiao, Yong;Yu, Jie
一个双峰银纳米粒子（AgNP）浆料已通过简单的超声混合的两种类型的单峰AgNP（10和50 nm的直径）。通过在250 ℃下烧结该浆料30 min，我们获得了278.5 W m（-1）K-1的热导率，约为块状Ag理论值的65%。在50-200 ℃下热循环1000次循环之前和之后的剪切强度分别为约41.80和28.75 MPa。结果表明，这种优异的性能归因于双峰AgNP浆料内部独特的烧结结构，包括其低但稳定的孔隙率和高密度的共格孪晶。此外，我们还系统地讨论了该浆料的烧结行为，包括有机层的分解和共格孪晶的形成。在这些结果的基础上，我们确认，我们的双峰AgNP浆料具有良好的潜力，作为高温功率器件应用的热界面材料。
A bimodal silver nanoparticle (AgNP) paste has been synthesized via the simple ultrasonic mixing of two types of unimodal AgNPs (10 and 50 nm in diameter). By sintering this paste at 250 degrees C for 30 min, we obtained an ultrahigh thermal conductivity of 278.5 W m(-1) K-1, approximately 65% of the theoretical value for bulk Ag. The shear strength before and after thermal cycling at 50-200 degrees C for 1000 cycles was approximately 41.80 and 28.75 MPa, respectively. The results show that this excellent performance is attributable to the unique sintered structures inside the bimodal AgNP paste, including its low but stable porosity and the high density coherent twins. In addition, we systematically discuss the sintering behavior of this paste, including the decomposition of the organic layers and the formation of the coherent twins. On the basis of these results, we confirm that our bimodal AgNP paste has excellent potential as a thermal interface material for high temperature power device applications.