Dissolution of Solid Copper into Molten Tin-Lead Alloys under Static Conditions
Dissolution of Solid Copper into Molten Tin-Lead Alloys under Static Conditions
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DOI：
10.2320/matertrans1960.21.819
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发表时间：
1980
影响因子：
1.2
通讯作者：
Yoshifusa Shoji;Sôsuke Uchida;T. Ariga
中科院分区：
文献类型：
--
作者：
Yoshifusa Shoji;Sôsuke Uchida;T. Ariga
采用三种反应偶方法研究了673K下静态条件下铜在锡铅合金熔体中的溶解。由于熔体中锡的饱和浓度不同，铜的溶解随熔体中锡浓度的增加而增加。研究了富锡合金中铜在液相上下和液相夹层条件下的溶解差异。这种差异是由于熔体密度差异引起的自然对流造成的。在固液界面处形成的合金层的厚度随着接近饱和和熔体中锡浓度的增加而增加。
The dissolution of copper into molten tin-lead alloys has been studied at 673 K under static conditions using three kinds of reaction couple method. The dissolution of copper increased with increasing tin concentration of the melt owing to the difference in the saturation concentration of the melt. The differences in the dissolution of copper between the liquid lower and upper conditions and between the upper and lower coppers under the liquid sandwiched condition were obtained in tin-rich alloys. The differences were attributed to the natural convection resulting from the density difference in the melt. The thickness of the alloy layer formed at a solid-liquid interface increased with approaching to the saturation and with increasing concentration of tin in the melt.