Analysis of Cracking and Delamination of Sputtered Thin Films during Wear Process
Analysis of Cracking and Delamination of Sputtered Thin Films during Wear Process
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溅射薄膜磨损过程中的裂纹和分层分析
DOI：
10.4028/www.scientific.net/kem.297-300.1718
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
Masahiko Kato
中科院分区：
文献类型：
--
作者：
K. Nakasa;T. Setyanto;Bo Zhang;J. Zheng;Masahiko Kato
在纯钛衬底上溅射沉积了碳化硅或钴铬镍氧化物薄膜，并在“球盘式”试验机上进行了磨损试验。薄膜表面出现与碳化硅球滑动方向成45°夹角的半圆形平行裂纹，破裂后薄膜很快发生分层。借助于有限元方法，得到了薄膜破裂前后的应力分布。球体背面接触边薄膜中存在的最大拉应力是产生半圆形平行裂纹的原因。薄膜破裂后，在裂纹尖端出现垂直于界面的拉应力和沿界面的剪应力。这两种应力的共同作用是薄膜破裂后分层的主要原因。
Pure titanium substrate specimen was sputter-coated with SiC or CoCrNi-oxide thin film and the wear test was carried out by using a “ball-on-disk” type testing machine. The semi-circular parallel cracks appeared on the film surface with angles of 45 degree to the sliding direction of the SiC ball and the delamination of film quickly occurred after the cracking. With the aid of finite element methods, stress distribution before and after cracking in the film was obtained. The maximum tensile stress existing in the film at the back-contact edge of ball is the reason for the initiation of semi-circular parallel cracks. After the film is cracked, the tensile stress normal to interface as well as the shear stress along interface appear at crack tip. The combination of these two stresses is the main reason for the delamination after the film is cracked.