3D Lamellar-Structured Graphene Aerogels for Thermal Interface Composites with High Through-Plane Thermal Conductivity and Fracture Toughness.
3D Lamellar-Structured Graphene Aerogels for Thermal Interface Composites with High Through-Plane Thermal Conductivity and Fracture Toughness.
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用于具有高平面导热率和断裂韧性的热界面复合材料的 3D 层状结构石墨烯气凝胶
DOI：
10.1007/s40820-020-00548-5
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发表时间：
2020-11-11
影响因子：
26.6
通讯作者：
Yu ZZ
中科院分区：
文献类型：
--
作者：
Liu P;Li X;Min P;Chang X;Shu C;Ding Y;Yu ZZ
制备了具有垂直排列和紧密堆叠的高质量石墨烯片层结构的片状石墨烯气凝胶。气凝胶优越的导热能力使环氧树脂在石墨烯含量为2.30 vol%时具有20.0 W m−1 K−1的高通平面导热系数。珠状结构使环氧复合材料具有较强的断裂韧性。虽然导热石墨烯片能有效提高聚合物的面内热导率，但所得到的纳米复合材料通常表现出较低的平面内热导率，限制了其作为热界面材料的应用。本文通过双向冷冻PAAS/GO悬浮液并进行冻干，构建了层状结构的聚酸盐/氧化石墨烯（PAAS/GO）杂化气凝胶。随后，PAAS单体聚合成聚酰亚胺（PI），而氧化石墨烯在300℃的热退火过程中转化为热还原氧化石墨烯（RGO）。在2800℃下的最终石墨化将PI转化为石墨化碳，利用RGO的感应效应，同时RGO被热还原和愈合为高质量的石墨烯。因此，首次制备出具有优良通平面导热性能的层状结构石墨烯气凝胶，其优越的通平面导热性能源于其垂直排列且紧密堆叠的优质石墨烯片层。用环氧树脂真空浸渍后，石墨烯含量为2.30 vol%的环氧复合材料的通面导热系数高达20.0 W m−1 K−1，是环氧树脂的100倍，比导热系数提高了4310%。此外，层状结构的石墨烯气凝胶使环氧树脂具有较高的断裂韧性，是环氧树脂的1.71倍。本文的在线版本（10.1007/s40820-020-00548-5）包含补充资料，授权用户可使用。
Lamellar-structured graphene aerogels with vertically aligned and closely stacked high-quality graphene lamellae are fabricated. The superior thermally conductive capacity of the aerogel endows epoxy with a high through-plane thermal conductivity of 20.0 W m−1 K−1 at 2.30 vol% of graphene content. The nacre-like structure endows the epoxy composite with enhanced fracture toughness. Although thermally conductive graphene sheets are efficient in enhancing in-plane thermal conductivities of polymers, the resulting nanocomposites usually exhibit low through-plane thermal conductivities, limiting their application as thermal interface materials. Herein, lamellar-structured polyamic acid salt/graphene oxide (PAAS/GO) hybrid aerogels are constructed by bidirectional freezing of PAAS/GO suspension followed by lyophilization. Subsequently, PAAS monomers are polymerized to polyimide (PI), while GO is converted to thermally reduced graphene oxide (RGO) during thermal annealing at 300 °C. Final graphitization at 2800 °C converts PI to graphitized carbon with the inductive effect of RGO, and simultaneously, RGO is thermally reduced and healed to high-quality graphene. Consequently, lamellar-structured graphene aerogels with superior through-plane thermal conduction capacity are fabricated for the first time, and its superior through-plane thermal conduction capacity results from its vertically aligned and closely stacked high-quality graphene lamellae. After vacuum-assisted impregnation with epoxy, the resultant epoxy composite with 2.30 vol% of graphene exhibits an outstanding through-plane thermal conductivity of as high as 20.0 W m−1 K−1, 100 times of that of epoxy, with a record-high specific thermal conductivity enhancement of 4310%. Furthermore, the lamellar-structured graphene aerogel endows epoxy with a high fracture toughness, ~ 1.71 times of that of epoxy. The online version of this article (10.1007/s40820-020-00548-5) contains supplementary material, which is available to authorized users.
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