Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling
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DOI：
10.1016/j.microrel.2006.07.057
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发表时间：
2006-09
期刊：
影响因子：
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通讯作者：
L. Dupont;Z. Khatir;S. Lefebvre;S. Bontemps
中科院分区：
文献类型：
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作者：
L. Dupont;Z. Khatir;S. Lefebvre;S. Bontemps
