Molecular Dynamics Study on Mold and Pattern Breakages in Nanoimprint Lithography
Molecular Dynamics Study on Mold and Pattern Breakages in Nanoimprint Lithography
复制标题
纳米压印光刻模具和图案破损的分子动力学研究
DOI:
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发表时间:
2010
期刊:
影响因子:
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通讯作者:
Y. Hirai
中科院分区:
文献类型:
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作者:
M. Yasuda;K. Tada;Y. Hirai
Nanoimprint lithography (NIL) is one of the promising technologies for the fabrication of nanostructures at low cost (Chou et al., 1995) (Chou et al., 1996). In NIL, understanding the deformation behaviour of polymer during imprinting processes is an essential issue for high-speed and uniformed fabrication. Since numerical simulations can be efficient approaches for this issue, several studies using continuum mechanics are performed (Hirai et al., 2001) (Hirai et al., 2004) (Song et al., 2008). Continuum mechanics successfully predict the material deformation in submicron scale. However, as the pattern size becomes smaller than several tens of nanometers, continuum mechanics fails to analyze the material behaviour. Single-nanometre resolution has experimentally been demonstrated in NIL (Hua et al., 2004) (Hua et al., 2006). For the exact analysis of the material deformation in nanoscale system, the behaviour of atoms or molecules should be considered. Molecular dynamics (MD) simulation is a useful tool to study the deformation mechanism of the materials in atomic scale. Several MD studies on NIL process are reported. Kang et al. propose a MD simulation model of a NIL process imprinting an α-quartz stamp into an amorphous poly-(methylmethacrylate) film (Kang et al., 2007). In their study, the distributions of density and stress in the polymer film are calculated for the detail analysis of deformation behaviour. The qualitative agreement between the MD simulation and the experimental data for the density variation of patterned polymer is reported (Woo et al., 2007). Mold geometry effect on springback phenomenon in NIL process is also studied with the MD simulation (Yang et al., 2009). For metal direct imprinting, more MD studies are performed. Process parameters such as stamp taper angle, imprint depth, temperature and punch velocity are investigated for copper imprinting (Hsu et al., 2004) (Hsu et al., 2005). The mechanism of the atomic-scale friction is studied for aluminium imprinting (Hsieh & Sung, 2007). The metal film thickness effect on pattern formation is also studied (Cheng et al., 2007). Agreement between MD simulation and experimental results is reported for temperature effects on gold imprinting (Hsiung et al., 2009). MD simulation of nanoimprint for alloys is demonstrated (Fang et al., 2007). In order to save computational time, a multi-scale simulation for nanoimprint process that mixes the atomistic and continuum approaches is proposed (Wu & Lin, 2008). Recently, MD simulation of roller nanoimprint process is performed (Wu et al., 2009).