Creep at low stresses: An evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms
Creep at low stresses: An evaluation of diffusion creep and Harper-Dorn creep as viable creep mechanisms
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DOI：
10.1007/s11661-002-0087-4
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发表时间：
2002-02
期刊：
影响因子：
--
通讯作者：
T. Langdon
中科院分区：
文献类型：
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作者：
T. Langdon
高温蠕变实验经常揭示在非常低的应力下到应力指数减小到通常在0.1至2范围内的值的区域的转变。该区域通常与新蠕变机制的发生相关联，例如晶界滑动、扩散蠕变和/或Harper-Dorn蠕变。最近的几份报告表明，扩散蠕变和Harper-Dorn蠕变可能不是可行的蠕变机制。本文研究这两个过程，并表明，有很好的证据支持至少在某些实验条件下发生的蠕变机制。
High-temperature creep experiments often reveal a transition at very low stresses to a region where the stress exponent is reduced to a value lying typically in the range of ∼1 to 2. This region is generally associated with the occurrence of a new creep mechanism, such as grain-boundary sliding, diffusion creep, and/or Harper-Dorn creep. Several recent reports have suggested that diffusion creep and Harper-Dorn creep may not be viable creep mechanisms. This article examines these two processes and demonstrates that there is good evidence supporting the occurrence of both creep mechanisms under at least some experimental conditions.