Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap
Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap
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DOI：
10.1007/s11664-008-0537-x
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发表时间：
2009-01-01
影响因子：
2.1
通讯作者：
Ishida, K.
中科院分区：
文献类型：
--
作者：
Ohnuma, I.;Saegusa, T.;Ishida, K.
研究了电子材料用粉末在存在液相扩散间隙的体系中的微观结构。鸡蛋样的核心类型和均匀的第二相分散体的特征形态显示在相图中，其中热力学计算是合金设计和微观结构预测的有力工具。介绍了用气体雾化法制备的无铅焊料和高导电性Ag基微粉的组织演变和性能的典型实例。
The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.