Self-Packaged Balanced Bandpass Filters With Impedance Transformation Characteristic
Self-Packaged Balanced Bandpass Filters With Impedance Transformation Characteristic
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具有阻抗变换特性的自封装平衡带通滤波器
DOI：
10.1109/tmtt.2019.2936203
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发表时间：
2019-08
影响因子：
4.3
通讯作者：
Wu Wen
中科院分区：
文献类型：
--
作者：
Huang Feng;Aliqab Khaled;Wang Jianpeng;Hong Jiasheng;Wu Wen
本文首次提出了集成阻抗变换功能的新型自封装平衡带通滤波器（bpf）的协同设计。该设计基于改进的分支线路结构，该结构由两条不同的分支线路和两个相同的耦合线段组成。分析结果表明，所考虑的滤波器不仅可以实现具有阻抗变换特性的切比雪夫等纹波响应，而且利用这种改进的分支线结构可以有效地提高共模抑制的带宽。此外，根据指定的等纹波分数带宽（FBW）、带内回波损耗（RL）水平和阻抗变换比<inline-formula> < text -math notation="LaTeX">${m}$ </ text -math></inline-formula>，可以直接确定DM的频率响应。两个设计原型，具有50-75 -<inline-formula> < text -math符号="LaTeX">$\Omega $ </ text -math></inline-formula> （<inline-formula> < text -math符号="LaTeX">$m= 1.5$ </ text -math></inline-formula>）阻抗转换的二阶平衡BPF和具有50-200 -<inline-formula> < text -math符号="LaTeX">$\Omega $ </ text -math></inline-formula> （<inline-formula> < text -math符号="LaTeX">$m= 4$ </ text -math></inline-formula>）阻抗转换的三阶平衡BPF。采用多层液晶聚合物（LCP）键合印刷电路板（PCB）技术以自封装形式实现。理论、模拟和测量结果记录一致，很好地验证了设计概念。
In this article, the co-design of novel self-packaged balanced bandpass filters (BPFs) integrated with the functionality of impedance transformation is presented for the first time. The proposed design is based on a modified branch-line structure, which is composed of two different branch lines and two identical coupled-line sections. Analysis results show that the considered filters can not only achieve Chebyshev equal-ripple responses with impedance transformation properties for the differential mode (DM) but also can efficiently improve the bandwidth of the common-mode (CM) rejection with resorting to this modified branch-line structure. Furthermore, according to the specified equal-ripple fractional bandwidth (FBW), in-band return loss (RL) level, and impedance transformation ratio <inline-formula> <tex-math notation="LaTeX">${m}$ </tex-math></inline-formula>, the DM frequency response can be directly determined. Two design prototypes, the second-order balanced BPF with a 50–75-<inline-formula> <tex-math notation="LaTeX">$\Omega $ </tex-math></inline-formula> (<inline-formula> <tex-math notation="LaTeX">$m= 1.5$ </tex-math></inline-formula>) impedance transformation and the third-order one with a 50–200-<inline-formula> <tex-math notation="LaTeX">$\Omega $ </tex-math></inline-formula> (<inline-formula> <tex-math notation="LaTeX">$m= 4$ </tex-math></inline-formula>) impedance transformation, are implemented in self-packaged forms by using the multilayer liquid crystal polymer (LCP)-bonded printed circuit board (PCB) technology. Theoretical, simulated, and measured results are recorded in good agreement, well verifying the design concept.
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