Thermal design considerations on wire-bond packages
Thermal design considerations on wire-bond packages
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引线键合封装的热设计注意事项
DOI：
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发表时间：
2009
期刊：
影响因子：
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通讯作者：
J. Muller
中科院分区：
文献类型：
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作者：
M. Mach;J. Muller
由于其优异的微波性能（低或中等介电损耗，高导电性油墨）和密封性，LTCC材料被广泛用于MMIC封装。后者通常需要保护裸模免受野外恶劣工作条件的影响。一些应用，如移动通信的前端模块或点对点系统的传输模块，需要热阻非常低的封装，因为高达70%的供电转换为热量。虽然玻璃陶瓷材料相比有机板具有更好的导热性，但仍有不足。热通孔是局部提高导热系数的一种方法。然而，它们的尺寸、体积材料、排列和层数对最终性能有很大的影响。MMIC上的热源（热点）、MMIC的厚度和可选的散热器也需要包括在评估中。先前的模拟表明，在热源下方应该放置尽可能多的热通孔。此外，热通孔应直接位于热点的下方。整个系统的环境，从裸模到散热器必须考虑在内，以及在封装的热路径。在这项调查中，考虑了各种结构。主要组成包括一个铝板作为散热器（热地），顶部粘接PCB，安装的封装和裸模作为封装中的热源。利用TriQuint公司的功率放大器TGA9083-SCC仿真模型作为裸模来实现一个真实的场景。本文通过仿真的方法考虑了不同的热概念。研究中的变量包括LTCC金属化材料、PCB设计和线键封装的安装材料。最低热阻的最佳系统是ltcc外壳，其插入的mocu板直接安装在板散热器上。
Due to their excellent microwave behaviour (low or moderate dielectric loss, highly conductive inks) and their hermeticity, LTCC materials are being widely used for MMIC packaging. The latter is often required to protect bare dies against the impact of harsh working conditions on the field. Several applications, such as front end modules for mobile communication or transmit modules for point-to-point systems, require packages with very low thermal resistance, since up to 70% of the supplied power is converted into heat. Although glass ceramic materials have a better thermal conductivity compared to organic boards, it is still insufficient. Thermal vias are one way to locally improve the thermal conductivity. However, their dimensions, bulk material, arrangement and number of layers have a strong impact on the resulting performance. Heat sources (hot spots) on the MMIC, the MMIC thickness and optional heat spreaders need to be included in the evaluation as well. Previous simulations showed that as many thermal vias as possible should be placed below the heat source. In addition, thermal vias should be directly located under the hot spot. The whole system with the environment from the bare die to the heat sink has to be taken into account, as well the heat path in the package. In this investigation various constructions are considered. The principal build-up consists of an Al-plate as heat sink (thermal ground) with a glued PCB on the top, the mounted package and the bare die as the heat source in the package. A simulation model of a power amplifier TGA9083-SCC from TriQuint was used as a bare die to realize a realistic scenario. The paper considers different thermal concepts by means of simulation. Variables in the studies are LTCC metallization materials, PCB designs and mounting materials for wire-bond packages. The optimal system for lowest thermal resistance is a LTCC-housing with an inserted MoCu-plate which is directly mounted onto the board heat sink.