A comparison of the strength of base metal and gold solder joints.
A comparison of the strength of base metal and gold solder joints.
复制标题
母材和金焊点强度的比较。
DOI：
10.1016/s0022-3913(84)80108-0
复制
发表时间：
1984
期刊：
影响因子：
--
通讯作者：
R. W. Dykema
中科院分区：
文献类型：
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作者：
R. Kriebel;B. Moore;C. Goodacre;R. W. Dykema
本研究的目的是评估在两种不同的基底金属合金之间形成高和低熔融焊点所涉及的程序，并将这些焊点的强度与由高金含量合金制成的试样之间形成的焊点的强度进行比较。这项调查的结论可归纳如下。120个样本中，除11个样本外，所有样本均通过焊点失败，这证实了焊点通常是固定局部义齿最薄弱的部分。在基底金属合金之间形成的高熔合接头显示出比在金合金试样之间形成的高熔合接头更高的相对弯曲强度值。低熔融接头之间形成的基础金属合金表现出较高的相对弯曲强度值比低熔融接头之间形成的金合金试样，低熔融的基础金属接头表现出最高的强度值在这项研究中。在金合金试样之间形成的低熔接头在断裂之前一直弯曲。焊接接头既会发生断裂（焊料与母材分离），也会发生内聚断裂（焊料、母材或两者的组合断裂）。金部件之间正确形成的接头应显示内聚断裂，而对于贱金属合金，粘合断裂显然是可接受的，因为低熔融贱金属接头以这种方式失效，但仍表现出高强度值。在大多数焊点中观察到不同尺寸和位置的空洞，并且在每个测试组中，具有较大孔隙面积的焊点通常表现出较低的强度。
The purpose of this study was to evaluate the procedures involved in forming high-and low-fusing solder joints between two different base metal alloys and to compare the strength of these joints with the strength of those formed between specimens made from a high-gold content alloy. The conclusions of this investigation can be summarized as follows. All but 11 of the 120 specimens failed through the solder joint, which confirms that the solder joint is usually the weakest part of a fixed partial denture. The high-fusing joints formed between the base metal alloys showed higher relative bending strength values than the high-fusing joints formed between the gold alloy specimens. The low-fusing joints formed between the base metal alloys showed higher relative bending strength values than the low-fusing joints formed between the gold alloy specimens, and the low-fusing base metal joints exhibited the highest strength values in this study. The low-fusing joints formed between gold alloy specimens consistently bent before fracturing. Solder joints fail both adhesively (separation of the solder from the parent metal) and cohesively (fracture through the solder, parent metal, or a combination of both). A correctly formed joint between gold components should show cohesive fracture, whereas adhesive fractures are apparently acceptable with base metal alloys since the low-fusing base metal joints failed in this manner but still exhibited high strength values. Voids of different sizes and locations were observed in most of the solder joints, and within each group tested there was usually less strength exhibited by the joints with larger areas of porosity.