Scratch drive actuator with mechanical links for self-assembly of three-dimensional MEMS
Scratch drive actuator with mechanical links for self-assembly of three-dimensional MEMS
复制标题
DOI：
10.1109/84.557525
复制
发表时间：
1997-03-01
影响因子：
2.7
通讯作者：
Fujita, H
中科院分区：
文献类型：
--
作者：
Akiyama, T;Collard, D;Fujita, H
多晶硅表面微加工零件自组装三维MEMS是一种非常有吸引力的技术。为了避免危险的外部操作，需要实际使用集成执行器来执行装配任务。为此，本文详细介绍了静电表面微机械划痕驱动驱动器（SDA）的特性。首先，通过多次SDA测试，该致动器能够产生30 μ N的阈值力，产率在60%以上。将SDA组成的多晶硅器件机械连接到屈曲梁上，在+/-112 V脉冲下证明了63 mN的水平力，在更高的电压下可以获得高达100 mu N的水平力。对于屈曲梁，在垂直方向上的位移可达150 μ m。在垂直方向上进行1 nJ功，产生100 mu m的位移，证实产生10 mu N的垂直力。最后，SDA通过产生足够的垂直力来完全释放宽多晶硅板（500 μ m x 50 μ m），而无需外部操作，证明了克服表面加工多晶硅的常见粘着。上述特性，无论是在结构释放方面，还是在垂直/水平力和位移方面，都为SDA提供了自组装复杂3d多晶硅部件的能力，开辟了MEMS新的集成能力和新的应用领域。
The self-assembling of three-dimensional (3-D) MEMS from polysilicon surface micromachined part is very attractive. To avoid risky external manipulation, the practical use of integrated actuator to perform the assembling task is required. To that goal, this paper presents detailed characteristics of the electrostatic surface micromachined scratch drive actuator (SDA). First, from numerous SDA test, it results that this actuator is able to produce a threshold force of 30 mu N, with a yield above 60%. With polysilicon devices consisting of SDA mechanically linked to buckling beam, a horizontal force of 63 mN have been demonstrated with +/-112 V pulse, and up to 100 mu N can be obtain with higher voltage. With buckling beams, displacements up to 150 mu m have been obtained in the vertical direction. The generation of vertical force of 10 mu N was confirmed with a 100 mu m displacement producing in 1 nJ work in the vertical direction. Finally, SDA proves to overcome the usual sticking of surface machined polysilicon by producing enough vertical force to completely release wide polysilicon plate (500 mu m x 50 mu m) without external manipulation. The above characteristic, both in terms of structure releasing and vertical/horizontai forces and displacements provide the SDA with the capability of self-assembling complex 3-D polysilicon part, opening new integration capabilities and new application held of MEMS.